But researchers at the University of Texas may have a cool solution – a new thermal interface material that can whisk heat away from processors better than the likes of Thermalright and Thermal ...
Researchers have engineered a material that is as soft as skin but ... Particularly, the existing materials are too rigid to lift heavy weights and too flexible to maintain precise control.
A team of researchers at the University of Minnesota has developed a next-generation transparent and efficient semiconductor material. This breakthrough could have enormous ramifications for ...