Hyperspectral imaging lidar system achieves remote plastic identification
Researchers have developed a new hyperspectral Raman imaging lidar system that can remotely detect and identify various types ...
Semiconductor Engineering16h
Laser Ablation Dicing Revolutionizes Ultra-Thin Wafer Saws Beyond The Capability Of Blade Dicing
Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.