But Intel needs a "no capital left behind" mindset, he added. Chandrasekaran, who joined Intel this year after two decades at ...
The datasheet for Queensgate’s NPS-XYP-250Q 300 mm wafer–mask alignment stage is now available. Goodman describes it as, “the ...
YES announced today that it is releasing the 3rd generation VertaCure curing systems for use in manufacturing advanced packaging solutions.
In 2015, Toshiba announced the first 16-die stack using through-silicon vias ... Consequently, some developers are turning to ...
As Moore's Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density, as de ...
Jazz musician Roy Haynes, whose eclectic drumming style helped define the genre, has died, according to reports. He was 99. Haynes died Tuesday in Nassau County, New York, following a brief ...
Powered by Fantom Width Laser Dicing (FWLD) technology, the BlackStar helps maximize die yield per wafer and minimize ...
Former deputy prime minister John Prescott has died at the age of 86 following a battle with Alzheimer's. The news was announced by his family, who said the politician died peacefully surrounded ...
Abstract: This paper reviews advances in die/dielet-to-dielet (D2D), dielet-to-wafer (D2W) and dielet-to-substrate integration for advanced packaging. Key D2D and D2W integration approaches such as ...
translating to more than twice as many dies per wafer while providing the same voltage and current rating capability of our current device. This next-generation B-TRAN die design is part of our ...