The chip industry is pushing to quadruple the stack height of 3D NAND flash from 200 layers to 800 layers or more over the next few years, using the additional capacity will help to feed the unending ...
YES announced today that it is releasing the 3rd generation VertaCure curing systems for use in manufacturing advanced packaging solutions.
Robbins LLP informs investors that a class action was filed on behalf of persons and entities that purchased or otherwise acquired Aehr Test Systems, Inc. securities between January 9, 2024 and March ...
Jazz musician Roy Haynes, whose eclectic drumming style helped define the genre, has died, according to reports. He was 99. Haynes died Tuesday in Nassau County, New York, following a brief ...
As Moore's Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density, as de ...
Bobby Allison, whose life in NASCAR included both grand triumphs and unspeakable heartbreak, died Saturday, NASCAR announced. He was 86. Through NASCAR, Allison became a champion driver and a Hall ...
Powered by Fantom Width Laser Dicing (FWLD) technology, the BlackStar helps maximize die yield per wafer and minimize ...
Former deputy prime minister John Prescott has died at the age of 86 following a battle with Alzheimer's. The news was announced by his family, who said the politician died peacefully surrounded ...
The devoted mother of two - who made it through the show's Boot Camp stage and performed at Wembley Arena - tragically died after feeling unwell over the weekend. Stephanie was a cherished member ...
Abstract: This paper reviews advances in die/dielet-to-dielet (D2D), dielet-to-wafer (D2W) and dielet-to-substrate integration for advanced packaging. Key D2D and D2W integration approaches such as ...
translating to more than twice as many dies per wafer while providing the same voltage and current rating capability of our current device. This next-generation B-TRAN die design is part of our ...