NVIDIA's vision of the future of AI compute: silicon photonics interposer, GPU 'tiers' possible GPU on GPU, 3D stacked DRAM ...
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AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new techRedistribution layers — which route signals and power between the chip and external components using high-density ...
MKS Instruments is leading the way in PCB, package substrate, and many areas of wafer-level packaging. At the TPCA Show Taipei 2024, the company presented a wide range of solutions from its ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
TOKYO, JAPAN / ACCESSWIRE / December 9, 2024 / Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi ...
Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI, and networking applications. The PHY’s flexible ...
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