The die bonder equipment market is estimated to be worth USD 4,415.3 million in 2023 and is set to surpass USD 6,726.7 ...
Die bonders are specialized semi- or fully-automatic high-precision machine tools used in semiconductor device fabrications. Die bonders fix the semiconductor chip, or die, to the substrate, package, ...
Description: Overview The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level ...
Description: Overview The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level ...
EMS provider Escatec has integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes. The company has built a customised ...
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Description: RF-SOE Disk drives Large complex hybrids RF and microwave devices High frequency passive and active components MCM power connections Fine pitch devices Running stitch interconnects ...