NVIDIA's vision of the future of AI compute: silicon photonics interposer, GPU 'tiers' possible GPU on GPU, 3D stacked DRAM ...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and ...
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AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new techRedistribution layers — which route signals and power between the chip and external components using high-density ...
They employ high temperature FR4/G10 substrate which allows package soldering and rework without damage. Gold plated press fit pins and short trace lengths insure high integrity in mechanical and ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
TOKYO, JAPAN / ACCESSWIRE / December 9, 2024 / Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi ...
Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI, and networking applications. The PHY’s flexible ...
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