Cavity, one of the most common and basic techniques in ceramic package substrate design, has become more and more important in package or SiP deign. Currently, with technique improvements, some ...

The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and ...

We have developed a package-compatible granular material, CoFeHfO, on a printed circuit board by reactive sputtering and investigated the substrate dependence of its soft magnetic property. Atomic ...

Glass substrate is a material used in the packaging of semiconductors, particularly for integrated circuits (ICs). It provides a sturdy and reliable platform for mounting and connecting the various ...

This chapter discusses the construction, manufacturing process, design features, system integration capability, package performance, diversities in technology, and applications of embedded die in ...