Electronic packaging consists of a plastic, ceramic, or metal enclosure that houses an integrated circuit (IC) on a silicon or metal die. Electronic packaging and interconnect components are an ...

Bonding Die bonding is the attachment of IC chips or dies using an adhesive into a package. Back Grinding Thinning of dies or chips using back grinding processes to improve thermal dissipation and ...

A concise summary of the state of the art, this book is an interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability ...