【NIKKEI ...

たまに質問が矢継ぎ早に出て、大混乱になることがありますが。驚くべきことに、一番よくある質問は回路設計のことではなく、開発ラボ環境で超小型の最新ICパッケージを扱う際にICを損傷せずに回路を大きく変更するにはどうしたらよいか、という内容 ...

Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel... Japanese IC ...

図研は11月26日、12月11日～13日にかけて東京ビッグサイトにて開催される半導体産業の国際展示会「SEMICON Japan ...

Glass substrate is a material used in the packaging of semiconductors, particularly for integrated circuits (ICs). It provides a sturdy and reliable platform for mounting and connecting the various ...

The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and ...

As package dimensions increase, feature sizes decrease and novel materials such as ... even for varying panel topographies. For advanced IC substrate applications, direct imaging represents a new ...

As package dimensions increase ... even for varying panel topographies. For advanced IC substrate applications, direct imaging represents a new category beyond steppers for lithography.