The global die bonder equipment market was valued at $785.2 million in 2023, and is projected to reach $1,861.3 million by 2032, growing at a CAGR of 10.8% from 2024 to 2032. Market Introduction and ...

The Split Die Thermal Bonder provides you with an affordable alternative to RF die bonding The Split Die Thermal Bonder provides you with an affordable alternative to RF die bonding. This unit applies ...

Description: Overview The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level ...

Description: Overview The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level ...

Electronics Manufacturing Services (EMS) provider Escatec has integrated a UV curing light with a die bonder to boost the precision and efficiency of micro-assembly and printed circuit board (PCB) ...

MRSI Systems’ recently launched MRSI-HVM3 die bonder system has entered a volume production phase, using advanced demand flow technology to satisfy worldwide customer demand. Launched at the China ...

The physical edge of the die is not a good reference for wire bonding because of slight inconsistencies of overall die dimensions. This application note will briefly discuss die dimensions, die ...

EMS provider Escatec has integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes. The company has built a customised ...

Ultrasonic power is introduced during thermocompression bonding to perform a die bonding process at low temperature and pressure. The paper describes briefly which requirements are applicable to ...